Brown Fused Alumina for Circuit Boards
High-purity insulating and thermally conductive base material for advanced circuit board manufacturing.
Why Use BFA in Circuit Boards?
Brown fused alumina (BFA) is increasingly used in the base layer of ceramic-filled PCBs and thermal substrates due to its excellent dielectric strength, thermal conductivity, and structural stability. It supports both heat dissipation and electrical insulation, critical for high-performance and miniaturized electronics.
- Thermally conductive and electrically insulating
- High alumina content ensures long-term reliability
- Stable under SMT and soldering process temperatures
Common PCB Applications
- Alumina-filled thermal substrates for power ICs
- Insulating base layers in multilayer PCBs
- Ceramic core PCBs for LED and RF boards
BFA-based ceramics are compatible with DBC (Direct Bonded Copper) and AMB (Active Metal Brazing) techniques.
Recommended Particle Sizes
- Filler for thermal substrates: F180–F400 microgrits
- Dielectric ceramics pressing: F60–F220
- Surface polishing & slurry: F320–F800
Available in high-purity, low-Na₂O formulations to prevent circuit degradation.
Request Technical Data Sheet